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1 1 f o 1 e g a p 0 0 . 1 . v e r 0 0 1 0 j e 7 6 0 0 s d 8 0 r nov 05, 2 0 1 2 t e e h s a t a d ph5504a2na1 ambient light sensor des cript ion the p h55 0 4 a 2 na1 i s a n a m b i ent light s en s o r w ith a p hot o d iod e a n d c u r r e n t a m pli f i er. t h i s p r o duct has s p ect ral c h aracteristics clo se to h u m an eye sen sitiv ity and o u t put s light curren t prop ortion al t o t h e a m b i e n t brigh t n ess. the p h55 04a2 na1 c a n b e use d to i m prov e t h e p e r f orm ance a n d red u c e t h e p o w e r c onsu m p tion o f d i g ital e q u i p m ent s u c h a s fpd-tv s ets and m o b ile p hon es, by enabling aut o m atic bright ness contro l a n d a u t o m atic swi t c h i n g o n and o f f o f lighting s y s t e m s . fea t ure s ? s m a ll a nd t h i n s o n p acka g e 2 . 5 5 x 1 . 5 6 x 0 . 5 5 m m ? s p ectral c h aracteristics clo se t o h u m a n eye sen sitiv ity peak sen sitiv ity wav elengt h 5 3 0 n m typ. ? the im pact of i n frare d light ca n be reduce d by i n corporating i n frared ligh t c o rrectio n circu its. ? o u t put c h aracteristics p r o p ort i onal to illu m i n an ce ? out put lig h t c u rre n t 5 5 a typ.@1 0 0 l x (fluorescen t lig h t ) ? r educ e d v a r i a t i on o f out put c u r ren t a m o n g l i ght s o urces ? low voltag e o p eration v cc = 1 . 8 t o 5 . 5 v ? pb -f ree applications ? fpd t v sets, displays ? m obile p h o n e s , sm art pho nes ? n o teb ook pcs, tab l et pcs ? dscs, dvcs ? fa e q u i p m ent ? lighting syste m s, etc. r08 d s0 067e j01 00 rev.1.00 nov 05, 201 2 a bu s i n e ss par tne r o f r e n esas elec t ro nics c orp o r a tio n .
ph5504a2na1 chapter title 11 fo 2 egap 00.1.ver 0010je7600sd80r nov 05, 2012 package dimensions (unit: mm) 1 3 6 4 bottom view top view side view (0.25) 5.0 55.0 0.2 0.22 0.2 1.560.15 2.550.2 2.25 2 5 remark pin 1 is distinguishable by the shape of the lead frame. remark ( ) indicates nominal dimensions. pin no. te rmin al 1 ou t 2 gnd 3 v cc 4 nc 5 nc 6 nc rem ark 1. connect all the nc termina ls to gnd or v cc . 2. t he bypass capacitor betw een v cc a nd g nd is to be mo unted with in 20 mm of the package body. a b usine ss par tn er o f ren esas ele ctro nics c or pora ti on.
ph5504a2na1 chapter title r08ds0067ej0100 rev.1.00 page 3 of 11 nov 05, 2012 block diagram out light source gnd v cc marking example (bottom view) 1 pin assembly code product code 04 ordering information part number order number solder plating specification packing style ? PH5504A2NA1-E4 PH5504A2NA1-E4-y-a pb-free embossed tape 5 000 pcs/reel a b usine ss par tn er o f ren esas ele ctro nics c or pora ti on.
ph5504a2na1 chapter title r08ds0067ej0100 rev.1.00 page 4 of 11 nov 05, 2012 absolute maximum ratings (t a = 25 c, unless otherwise specified) parameter symbol ratings unit supply voltage v cc 6 v light current i o 5 ma power dissipation *1 p d 135 mw operating temperature t opt ? 30 to +85 c storage temperature t stg ? 40 to +100 c note: *1. mounted on glass epoxy board (18 mm 13 mm t 0.8 mm) recommended operating conditions parameter symbol min. typ. max. unit supply voltage v cc 1.8 3.0 5.5 v electro-optical characteristics (t a = 25 c, v cc = 3.0 v, unless ot herwise specified) parameter symbol conditions min. typ. max. unit supply current *1 i cc e v = 100 lx *2 ? 63 ? a peak sensitivity wavelength p ? ? 530 ? nm light current *1 i o0 e v = 0 lx ? ? 0.2 a i o1 e v = 100 lx *2 44 55 66 a sensitivity ratio of fluorescent/incandescent ? e v = 100 lx ? 1 ? multiple saturation output voltage *3 v o e v = 100 lx, r l = 150 k *2 2.6 2.9 ? v switching rise time t r r l = 5 k *5 ? 80 ? s time *4 fall time t f ? 140 ? s delay time t d ? 250 ? s storage time t s ? 5 ? s note: *1 measured under load resistance conditions of an outpu t current unsaturated *2 fluorescent light *3 saturation output voltage measurement method: light source illuminance (lx) v cc ph5504a gnd out r l v cc v cc v o a b usine ss par tn er o f ren esas ele ctro nics c or pora ti on.
ph5504a2na1 chapter title r08ds0067ej0100 rev.1.00 page 5 of 11 nov 05, 2012 *4 switching time pulse input input output v cc ph5504a gnd out r l v cc t d t s 90% 10% t r t f *5 white led a b usine ss par tn er o f ren esas ele ctro nics c or pora ti on.
ph5504a2na1 chapter title r08ds0067ej0100 rev.1.00 page 6 of 11 nov 05, 2012 typical characteristics (t a = 25 c, v cc = 3.0 v, unless ot herwise specified) 1.1 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 300 400 500 600 700 800 900 0 0.5 1 1.5 2 1 000 1 100 1 200 0 0.2 0.4 0.6 0.8 1 1.2 ? 90 ? 60 ? 30 0 30 60 90 0 0.2 0.4 0.6 0.8 1 1.2 ? 90 ? 60 ? 30 0 30 60 90 wavelength (nm) ratio angle (deg.) angle (deg.) ratio ratio ratio white led krypton light halogen light incandescent light fluorescent light spectral sensitivity characteristics directional characteristics 1 directional characteristics 2 light source sensitivity variation 1 pin + ? 1 pin + ? remark the graphs indicate nominal characteristics. a b usine ss par tn er o f ren esas ele ctro nics c or pora ti on.
ph5504a2na1 chapter title r08ds0067ej0100 rev.1.00 page 7 of 11 nov 05, 2012 0 0.2 0.4 0.6 0.8 1.2 1 1.4 ? 40 0 0.01 0.1 1 0.001 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 v cc (v) ratio ratio ? 40 ? 20 0 20 40 60 80 100 ? 200 20406080100 0.2 0.4 0.6 0.8 1 1.2 1.4 6 illuminance (lx) at 100 lx (normalized at v cc = 3 v) v cc dependency of light current current at 100 lx (normalized at 25 c) temperature dependency of light light current vs. illuminance of light current at 0 lx temperature dependency i o1 ( a) i o0 ( a) temperature (c) temperature (c) 0.01 0.1 1 000 10 000 101 100 1 0.1 0.01 10 1 000 100 10 000 remark the graphs indicate nominal characteristics. a b usine ss par tn er o f ren esas ele ctro nics c or pora ti on.
ph5504a2na1 chapter title r08ds0067ej0100 rev.1.00 page 8 of 11 nov 05, 2012 recommended optical layout (unit: mm) 0.14 1.275 1.275 offset 0.78 0.78 1 pin recommended area for light to hit (2.5 mm radius) light detecting area (0.54 x 0.18 mm) it is recommended to position the sensor so that light hits a circular area (shown by the dotted line) with a radius of 2.5 mm (diameter of 5 mm) from the center of the package. a b usine ss par tn er o f ren esas ele ctro nics c or pora ti on.
ph5504a2na1 chapter title r08ds0067ej0100 rev.1.00 page 9 of 11 nov 05, 2012 taping specifications (unit: mm) outline and dimensions (tape) tape direction outline and dimensions (reel) symbol dimensions (mm) a b w symbol dimensions (mm) c d e 130.2 2.00.5 21.00.8 180 +0 ?1.5 60 +1 ?0 9.0 +1 ?0 1 2 e w d c ba 2 1 perforation direction of feed product carrier tape cover tape product pin 1 2.00.1 4.00.1 0.20.05 0.780.05 3.50.05 1.750.1 8.00.2 0.780.05 2.9 1.95 4.00.1 1.050.05 1.5 +0.1 ?0 90 120 a b usine ss par tn er o f ren esas ele ctro nics c or pora ti on.
ph5504a2na1 chapter title r08ds0067ej0100 rev.1.00 page 10 of 11 nov 05, 2012 recommended mount pad dimensions (unit: mm) 0.24 0.24 0.22 0.5 0.5 0.5 0.5 0.22 0.22 0.22 1.85 0.55 remark all dimensions in this figure must be evaluated before use. a b usine ss par tn er o f ren esas ele ctro nics c or pora ti on.
ph5504a2na1 chapter title r08ds0067ej0100 rev.1.00 page 11 of 11 nov 05, 2012 notes on handling 1. recommended reflow soldering conditions (including infrared reflow, convection reflow, and infrared + convection reflow) (1) this product is dry-packed with desiccan t in order to avoid moisture absorption. (2) after breaking the seal, reflow soldering must be done within 168 hours under the recommended temperature profile shown below. (3) if more than 168 hours have passed after breaking the seal, the baking process must be done by using a tape and reel. baking conditions: once, with tape and reel, 60 5 c, 10 to 24 hours after the baking process, this product must be stored under conditions of 30 c or below, 70% rh or below, and reflow soldering must be done within 168 hours. < storage conditions after breaking seal > ? storage conditions : 30 c or below, 70% rh or below ? maximum storage period after breaking seal : 168 hours (second reflow soldering must be completed within 168 hours.) < reflow soldering conditions > ? peak reflow temperature : 260 c or below (package surface temperature) ? maximum number of reflows : 2 ? no repair by hand soldering ? maximum chlorine content of rosin flux (percentage mass) : 0.2% or less time recommended temperature profile of reflow package surface temperature 60 to 120 s 220c 255c 8 min. max. 150c ramp-up rate 3c/s max. ramp-down rate 6c/s max. peak temperature 260c max. 30 s or less 60 s or less 200c a b usine ss par tn er o f ren esas ele ctro nics c or pora ti on.
all trademarks and registered trademarks are t he property of their respective owners. c - 1 revision history ph5504a 2na1 data sheet description rev. date page summary 1.00 nov 05, 2012 first edition issued

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